A platinum chip sensor in SMD design on a printed circuit board

A platinum-chip sensor in SMD design on a printed circuit board

Platinum-chip temperature sensors

in SMD design type according to DIN EN 60751

Platinum sensors in SMD design are specially designed for automated assembly on printed circuit boards. Due to their small size they allow a high assembly density. The patented contact technology enables excellent processing results and high temperature cycle resistance.

High-quality solder contacts and processes for best connections

The solder contacts are completely free of phosphorus, sulfur or other impurities. This is the prerequisite for excellent solder joints, as only in this way can very clean intermetallic phases form during soldering.

The sensors can be used at temperatures of up to 250 °C and can withstand soldering processes of over 300 °C without any problems. They can be processed by a variety of methods, such as:

  • Soldering with lead-free solder
  • Soldering with leaded solder
  • High temperature solder (HMP)
  • Low temperature solder (LMPs)
  • Lead bonding
  • Ultrasonic wire bonding
Design types

PCS, PCF and PCF-B

Platinum chip temperature sensors are available in 3 designs types as standard. The types differ only in the design of the solder contacts. The PCS design has a contact on the reverse side (all-round contact), whereas the solder contact of the PCF design (flip chip) is on one side. In addition, there is a variant of this design (PCF-B) with a solderable, metallized rear side.

JUMO Platin-chip temperature sensors

Design type PCS - SMD with all-round contact Design type PCS SMD with all-round contact
  • High reliability thanks to first-class metallization of the contacts
  • high thermal shock resistance
  • Use at -50 to +150 °C, with suitable connection technology also at -70 to 250 °C
Design type PCF - SMD (flip chip) with one-sided contact Design type PCF SMD (flip chip) with one-sided contact
  • Flexible use even in tight spaces
  • Space-saving installation ensures up to 15% more space on the circuit board
  • High insulation resistance due to insulation of the side facing away from the board
Safe installation
Design type PCF-B - SMD (Flip-Chip) with contact on one side and solderable backside Bauform PCF-B SMD (flip chip) with one-sided contact and solderable backside
  • Solderable metallization (nickel-gold) on the back side
  • Enables fast response times due to direct thermal coupling
  • High temperature cycles resistance
More information

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